CYNTEC CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 7028
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 48314
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 39117
 
  
 
H01C RESISTORS1117
 
  
 
H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 962
 
  
 
H01H ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES 688
 
  
 
B22F WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER 547
 
  
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 555
 
  
 
H02H EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS 374
 
  
 
H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF 399

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0323,720 METHODS TO SPRAY PAINT ON A BODY OF AN INDUCTORMay 03, 17Nov 09, 17[H01F]
2017/0069,419 METHOD FOR PRODUCING MAGNETIC ELEMENT WITH TWO MAGNETIC CORES FOR INCREASING COILING SPACE AND MAGNETIC ELEMENT THEREOFDec 16, 15Mar 09, 17[H01F]
2017/0004,920 MAGNETIC COMPONENT AND METHOD OF MANUFACTURING MAGNETIC COMPONENTMar 28, 16Jan 05, 17[H01F]
2016/0164,725 Wireless System Package and Communication Method of Wireless System Package and Communication DeviceNov 19, 15Jun 09, 16[H04L, H04W]
2016/0141,102 SUBSTRATE-LESS ELECTRONIC COMPONENT AND THE METHOD TO FABRICATE THEREOFNov 13, 15May 19, 16[H01F]
2016/0113,117 Electronic module and the fabrication method thereofOct 15, 15Apr 21, 16[H05K]
2016/0113,141 INDUCTORDec 28, 15Apr 21, 16[H01F, H05K]
2015/0179,611 THREE-DIMENSIONAL PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOFSep 22, 14Jun 25, 15[H01L]
2015/0181,766 SUBSTRATE AND THE METHOD TO FABRICATE THEREOFSep 22, 14Jun 25, 15[H05K]
2015/0155,091 ELECTROMAGNETIC COMPONENT AND FABRICATION METHOD THEREOFFeb 13, 15Jun 04, 15[H01F]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9911715 Three-dimensional package structure and the method to fabricate thereofSep 22, 14Mar 06, 18[H01L, H05K]
9899131 Structure of an electronic component and an inductorSep 28, 15Feb 20, 18[H01F]
9872410 InductorDec 28, 15Jan 16, 18[H01F, H05K]
9859050 Method for producing magnetic element with two magnetic cores for increasing coiling space and magnetic element thereofDec 16, 15Jan 02, 18[H01F]
9859250 Substrate and the method to fabricate thereofSep 22, 14Jan 02, 18[H01L, H05K]
9831023 Electrode structure and the corresponding electrical component using the same and the fabrication method thereofJul 06, 15Nov 28, 17[H01L, H01F]
9805860 Magnetic device and method of manufacturing the sameJan 19, 17Oct 31, 17[H01F]
9799722 Inductive component and package structure thereofOct 05, 16Oct 24, 17[H01L, H01F]
9772459 Optoelectronic module and method of producing sameDec 15, 15Sep 26, 17[G02B]
9754713 ChokeJul 08, 15Sep 05, 17[H01F]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0148,955 Method of wafer level packaging of a moduleAbandonedNov 22, 15May 25, 17[H01L, H01S]
2017/0011,841 Transformer StructureAbandonedDec 28, 15Jan 12, 17[H01F]
2015/0303,538 COMPACT BATTERY WITH HIGH ENERGY DENSITY AND POWER DENSITYAbandonedApr 15, 15Oct 22, 15[H01M]
2013/0300,529 COIL STRUCTURE AND ELECTROMAGNETIC COMPONENT USING THE SAMEAbandonedApr 23, 13Nov 14, 13[H01F]
2012/0262,074 DRIVING CIRCUIT OF LIGHT EMITTING DIODES HAVING AT LEAST ONE BYPASS CIRCUIT, AND DRIVING METHOD THEREOFAbandonedMar 20, 12Oct 18, 12[H05B]
2012/0263,978 ENERGY STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAMEAbandonedApr 12, 12Oct 18, 12[H01M, H05K]
2012/0231,154 CERAMIC DEVICE AND METHOD FOR FABRICATING THE SAMEAbandonedJan 19, 12Sep 13, 12[H05K]
8089741 Over-voltage protection device and method for manufacturing thereofExpiredJul 26, 09Jan 03, 12[H02H]
2011/0090,648 ELECTRONIC PACKAGE STRUCTUREAbandonedDec 17, 10Apr 21, 11[H05K]
2010/0308,950 CHOKEAbandonedDec 18, 09Dec 09, 10[H01F]
2010/0182,114 METHOD FOR ADJUSTING INDUCTANCE OF CHOKE AND METHOD FOR DESIGNING CHOKEAbandonedSep 04, 09Jul 22, 10[H01F]
2010/0182,115 WIRE WOUND TYPE CHOKE COILAbandonedSep 22, 09Jul 22, 10[H01F]
2009/0231,077 INDUCTORAbandonedMay 07, 08Sep 17, 09[H01F]
2009/0207,574 ELECTRONIC PACKAGE STRUCTUREAbandonedJun 20, 08Aug 20, 09[H05K]
2009/0009,281 Fuse element and manufacturing method thereofAbandonedJul 06, 07Jan 08, 09[H01L, H01H]
2008/0179,722 ELECTRONIC PACKAGE STRUCTUREAbandonedOct 31, 07Jul 31, 08[H01L]
2008/0180,921 ELECTRONIC PACKAGE STRUCTUREAbandonedMar 12, 07Jul 31, 08[H05K]
2007/0075,826 METHOD FOR MANUFACTURING CHIP RESISTOR NETWORKSAbandonedJun 16, 06Apr 05, 07[H01C]
2006/0284,340 Method for preventing the overflowing of molding compound during fabricating package deviceAbandonedJul 29, 05Dec 21, 06[B29C]
2006/0220,188 Package structure having mixed circuit and composite substrateAbandonedJul 29, 05Oct 05, 06[H01L]

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